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Omni-Pac and HP Join Forces to Revolutionize Molded Fiber Production and Reduce CO2 Emissions

Pioneering Collaboration Drives Digital Transformation and Sustainability in the Packaging Industry.

June 27, 2023

PALO ALTO, Calif., June 27, 2023 – Omni-Pac Group, a leading molded fiber packaging provider, has partnered with HP to digitize and transform the way molded fiber is produced at an industrial level. This collaboration is helping Omni-Pac reduce CO2 emissions and replace single-use plastics with more sustainable packaging solutions. By working together both companies are driving innovation and sustainability in the molded fiber industry.

Pablo Libreros, CEO of Omni-Pac Group, expressed his excitement, emphasizing the company's leading role in driving innovation and sustainability within the industry through their partnership with HP. "Our collaboration with HP allows us to revolutionize the production of molded fiber at an industrial scale, transforming the development, launch, and production of molded fiber applications. This not only reduces environmental impact but also pioneers sustainable packaging solutions." He further highlighted the significant benefits of their collaboration, stating, "Enabling us to achieve over 500 tons per machine par year through digitalization, the level of CO2 savings will continue to improve as our collaboration with HP progresses."

HP's Molded Fiber Tooling Solution provides a customized digital solution for companies like Omni-Pac, enabling them to achieve unprecedented levels of efficiency and sustainability. The adoption of HP's technology empowers Omni-Pac to deliver innovative products that meet the evolving needs of consumers and businesses. The solution includes the new HP Molded Fiber Advanced Tooling technology, which optimizes manufacturing processes, delivering high-quality products with enhanced performance through Computational Fluid Dynamics (CFD) grammage control and customized features like logos and textures. Additionally, it significantly enhances Molded Fiber packaging sustainability by reducing the carbon footprint during tooling and part production, resulting in lighter parts with equal or better performance.

Mariona Company, Global Head of Fiber-Based Sustainable Packaging at HP, emphasized the significance of the collaboration, saying, "HP's Molded Fiber Tooling Solution technology is empowering companies like Omni-Pac to deliver efficiencies, enable new products, and reduce CO2 emissions. By working together, Omni-Pac and HP are at the forefront of driving innovation and sustainability in the molded fiber industry."

HP’s ambition is to be a lighthouse brand for purpose. By 2030, the company intends to become the world’s most sustainable and just technology company. With a shared vision and common goals, Omni-Pac and HP are united in their commitment to creating a better future. This collaboration serves as a testament to the power of innovation, driving the industry towards a more sustainable and environmentally conscious approach to packaging production. With packaging as a key element of product lifecycles, this partnership will be essential to driving recyclability and circularity across industries, as noted in the latest issue of HP Innovation.


About Omni-Pac Group  

Omni-Pac Group is one of the leading European molded fiber companies, supporting its customers safeguarding the planet by providing recyclable and compostable packaging solutions primarily for the food and medical sectors along with other industries. Omni Pac Group has operations in France, UK and Germany, and has a long-standing position on sustainability, deriving from the start of its operations a significant part of its raw materials from recycling. For more information, please visit:


About HP

HP Inc. (NYSE: HPQ) is a global technology leader and creator of solutions that enable people to bring their ideas to life and connect to the things that matter most. Operating in more than 170 countries, HP delivers a wide range of innovative and sustainable devices, services and subscriptions for personal computing, printing, 3D printing, hybrid work, gaming, and more. For more information, please visit:

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